Sugimoto, Yuka published the artcileEvaluation of heat resistance of metal-resin bonding using epoxy monoliths prepared with various epoxy resins and diamine curing agents, Safety of 4,4-Diaminodicyclohexyl methane, the publication is Nippon Setchaku Gakkaishi (2020), 56(8), 303-313, database is CAplus.
Epoxy monoliths with a co-continuous porous structure were produced by a thermosetting reaction using combinations oi 4 kinds of epoxy resins, 9 kinds of diamine curing agents, and 2 kinds porogens (pore forming agents), and applied to dissimilar materials bonding between metals and engineering plastics. An epoxy monolith was prepared on a stainless or copper plate, and a polycarbonate or poly (phenylene sulfide) plate was thermally welded to prepare a bonding test piece. The heat resistance of the epoxy monolith bonding systems used in this study was evaluated from the results of the tensile shear test before and after heat treatment. In addition, the thermogravimetric anal. of the monolith materials revealed the thermal decomposition behavior of the cured epoxy. Based on these results, the effects of the structure and the number of functional groups of the epoxy resins and the diamine curing agents on the porous structure bonding strength, and heat resistance of the epoxy monoliths were discussed.
Nippon Setchaku Gakkaishi published new progress about 1761-71-3. 1761-71-3 belongs to quinuclidine, auxiliary class Ploymers, name is 4,4-Diaminodicyclohexyl methane, and the molecular formula is C14H17FN4O3, Safety of 4,4-Diaminodicyclohexyl methane.
Referemce:
https://en.wikipedia.org/wiki/Quinuclidine,
Quinuclidine | C7H13N | ChemSpider